由中国材料研究学会计算材料学分会主办的“材料多尺度计算模拟国际会议”旨在为国内外科研工作者提供一个交流和展示多尺度计算模拟领域最新进展及成果的平台，促进材料多尺度计算模拟的发展，推动计算材料学领域内的学术进步以及相关行业的发展。经过多年的努力，材料多尺度计算模拟国际会议已经成为计算材料科学领域有影响力的国际会议之一。迄今为止，该会议已成功举办了13次。第14届材料多尺度计算模拟国际会议将于2022年7月4日-8日在成都举行，由电子科技大学承办，将围绕新型自旋电子材料及其输运特性、多体系统的量子理论与计算、高效能源转存材料与器件设计、拓扑电子态与拓扑磁性等方向的议题开展研讨。

组委会诚邀海内外相关领域的专家学者及企业界人士参会交流。相约成都，共创未来。

The International Conference of Multi-scale Modeling and Simulation of Materials (ICM³) is sponsored by the Computational Materials Science Branch of Chinese Materials Research Society (CMRS). The missions of ICM³ are to provide a platform for international researchers to communicate the latest progress in multi-scale computations and simulations, to promote the further development of multi-scale computational methods, and to connect the academic progress with the related industries. Since the first meeting on 2008, the ICM³ has been one of the most important academic conferences in the field of computational materials science with great efforts from each participant. The 14th ICM³ will be held at Chengdu, China from July 4th to 8th, 2022, hosted by the University of Electronic Science and Technology of China (UESTC). The topics include the new spintronic materials and their transport properties, quantum theory and simulation in many-body systems, non-adiabatic molecular dynamics, advanced materials and devices for energy conversation, topological states and topological magnetism, and some other hot topics related to novel electronic materials.

We are looking forward to the any contribution from domestic and international experts, scholars and entrepreneurs in the related research field. Welcome to ICM³, and welcome to Chengdu.